| PARYLENE
N |
| |
 |
| |
Parylene
N has the highest dielectric strength
of the three versions, and a dielectric
constant value independent of frequency.
It is able to penetrate crevices more effectively
than the other two versions because of the
higher level of molecular activity that
occurs during deposition. Parylene N is
commonly used in high frequency applications
because of its low dissipation factor and
dielectric constant values. |
|
| PARYLENE
C |
| |
 |
| |
Parylene
C differs chemically, having a
chlorine atom on the benzene ring that results
in a useful combination of electrical and
physical properties including particularly
low moisture and gas permeability. This
version deposits on substrates faster is
than Parylene N, with a consequent reduction
in crevice penetration activity. |
|
| PARYLENE
D |
| |
 |
| |
Parylene
D has two chlorine atoms added
to the benzene ring. This gives the resulting
film greater thermal stability than either
Parylene N or C. It has reduced ability
to penetrate crevices compared to Parylenes
N and C. |
|
